Researchers from A*STAR revealed a technical paper titled “FAPlace: Joint Optimization of Chiplet Placement and Interposer Footprint for two.5D Programs.”
Summary Excerpt: ” We suggest FAPlace, a footprint conscious masks guided sequential placement framework. FAPlace operates on a sufficiently massive canvas, eliminating the round dependency by permitting the optimum interposer footprint to emerge as an output of the optimization moderately than a pre-specified enter. At its core is a novel footprint masks that fuses space compactness with a side ratio penalty right into a unified spatial value map. Built-in with wirelength and thermal steering masks, FAPlace delivers holistic multi-physics optimization in a deterministic, single move course of. Experimental outcomes reveal that FAPlace reduces wirelength and footprint space whereas attaining near-unity side ratios, with out compromising on thermal efficiency.”
Discover the technical paper here. June 2026.
Hou, Yubo, Sezin Kircali Ata, Gen Liang Lim, Richard Chang, Mihai Dragos Rotaru, Rahul Dutta, and Ashish James. “FAPlace: Joint Optimization of Chiplet Placement and Interposer Footprint for two.5 D Programs.” In Proceedings of the Nice Lakes Symposium on VLSI 2026, pp. 942-947. 2026. Inventive Commons license.
